Hanoi (VNA) – Electronics giant Samsung of the Republic of Korea’s recent board meeting has approved the spending of some 850 million USD for its unit in Vietnam to manufacture flip-chip ball grid arrays (FC-BGA), according to KBS News.
FC-BGA is a highly-integrated package board used to connect a high-integration semiconductor chip to a main board.
FC-BGA is a highly-integrated package board used to connect a high-integration semiconductor chip to a main board.
The company will spend the investment in phases until 2023 to build the new FC-BGA production line.
According to the plan, the Vietnamese subsidiary will focus on producing FC-BGA while Samsung's factories in Suwon City (Gyeonggi) and Busan City will specialise in technology development and high-end products./.
According to the plan, the Vietnamese subsidiary will focus on producing FC-BGA while Samsung's factories in Suwon City (Gyeonggi) and Busan City will specialise in technology development and high-end products./.
VNA
